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Japan Intellectual Property Rights: BUILT-UP COLUMN

Japan, Aug. 6 -- IWABUCHI CORP has got intellectual property rights for 'BUILT-UP COLUMN.' Other related details are as follows: Application Number: JP,2024-029481 Category (FI): E04C3/36,E04C3/32,E... और पढ़ें


Japan Intellectual Property Rights: PIPE CONNECTING STRUCTURE

Japan, Aug. 6 -- FUTABA INDUSTRIAL CO LTD has got intellectual property rights for 'PIPE CONNECTING STRUCTURE.' Other related details are as follows: Application Number: JP,2024-027382 Category (FI)... और पढ़ें


Japan Intellectual Property Rights: VEHICLE UPPER STRUCTURE

Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'VEHICLE UPPER STRUCTURE.' Other related details are as follows: Application Number: JP,2024-026927 Category (FI): B60R13/... और पढ़ें


Japan Intellectual Property Rights: AIR CONDITIONER

Japan, Aug. 6 -- DAIKIN IND LTD has got intellectual property rights for 'AIR CONDITIONER.' Other related details are as follows: Application Number: JP,2024-026904 Category (FI): F24F13/22,228,F24F... और पढ़ें


Japan Intellectual Property Rights: DRIVE ASSISTING DEVICE

Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'DRIVE ASSISTING DEVICE.' Other related details are as follows: Application Number: JP,2024-026228 Category (FI): B62D6/00... और पढ़ें


Japan Intellectual Property Rights: POST-PROCESSING DEVICE AND RECORDING DEVICE

Japan, Aug. 6 -- SEIKO EPSON CORP has got intellectual property rights for 'POST-PROCESSING DEVICE AND RECORDING DEVICE.' Other related details are as follows: Application Number: JP,2025-104576 Cat... और पढ़ें


Japan Intellectual Property Rights: ANTENNA MODULE PLACEMENT AND HOUSING FOR REDUCED POWER DENSITY EXPOSURE

Japan, Aug. 6 -- QUALCOMM INC has got intellectual property rights for 'ANTENNA MODULE PLACEMENT AND HOUSING FOR REDUCED POWER DENSITY EXPOSURE.' Other related details are as follows: Application Num... और पढ़ें


Japan Intellectual Property Rights: RESIN SHEET FOR FORMING INSULATION LAYER OF SEMICONDUCTOR PACKAGE SUBSTRATE

Japan, Aug. 6 -- AJINOMOTO CO INC has got intellectual property rights for 'RESIN SHEET FOR FORMING INSULATION LAYER OF SEMICONDUCTOR PACKAGE SUBSTRATE.' Other related details are as follows: Applica... और पढ़ें


Japan Intellectual Property Rights: TRANSPORT FACILITY

Japan, Aug. 6 -- DAIFUKU CO LTD has got intellectual property rights for 'TRANSPORT FACILITY.' Other related details are as follows: Application Number: JP,2024-023704 Category (FI): G05D105:20,H10P... और पढ़ें


Japan Intellectual Property Rights: CONTROL DEVICE FOR ENGINE

Japan, Aug. 6 -- TOYOTA MOTOR CORP has got intellectual property rights for 'CONTROL DEVICE FOR ENGINE.' Other related details are as follows: Application Number: JP,2024-022889 Category (FI): F02D2... और पढ़ें